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High Temperature Resin

Printing Consumables

High Temperature Resin

BMF’s high temperature photosensitive resin can be used to manufacture engineering plastics with high resolution, flame and temperature resistance, excellent hardness and long-term stability which can be applied for industrial areas. It can be used among all DLP and SLA systems.

Features

01

   

Contains cyclobenzene, epoxy, polyurethane and many other functional groups

02

   

Contains cyclobenzene, epoxy, polyurethane and many other functional groups


03

   

Outstanding mechanical properties


04

   

Difficult deformation and excellent stability



  

Appearance Scheme

Application Areas

Applied to the components of automobile and air plane under relatively high temperature

Applied for the industry replaced engineering plastics




                   

Device Instruction

BMF Material Technology Inc